- test methods for bare wiressolderability test of coatingsolder globule methodthod
- 焊 weld; solder
- 球 sphere; globe
- 法 law
- 焊球 bead, solder; soldered ball; torch head; welded ball; weldedball
- 球法 marble process
- 焊球连接 sbc solder-ball connection
- 焊球阵列 bga ball grid array
- 操球法 ball handling
- 滚球法 rolling sphere method
- 环球法 ball and ring method; ball-and-ring method; ring and ball test
- 落球法 fall-ball method; falling here method; falling ball method; falling sphere method; falling-sphere method
- 棉球法 cotton pellet method
- 气球法 balloon method
- 全球法 francophonie
- 四球法 four ball method; four-ball method
- 握球法 grip
- 圆球法 spherical method
- 焊球剪切强度 bs ball shear strength
- 焊球阵列封装 tbga
- 塑料焊球阵列 pbga
- 陶瓷焊球阵列 cbga ceramic ball grid array
- 八字投球法 figure pitch
- 侧身投球法 set up position
- 长挥击球法 long swing
- 短挥击球法 short swing
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- Specification for solderability tester by globule method
焊球法可焊性测试仪.技术条件 - Test methods for bare wires - solderability test of coating - solder globule method
裸电线试验方法镀层可焊性试验焊球法
Last modified time:Mon, 18 Aug 2025 00:29:56 GMT