Smd . surface mounting technology - part 2 : transportation and storage conditions of surface mounting devices - application guide 表面安装技术.第2部分:表面安装装置
Smd . en 61760 - 2 surface mounting technology . part 2 : transportation and storage conditions of surface mounting devices . application guide 表面安装技术.第2部分:表面安装装置
Surface mounting technology part 2 : transportation and storage conditions of surface mounting devices - application guide 表面安装技术第2部分:表面安装元器件的运输和贮存条件-应用指南
Environmental testing . part 2 : tests . test te : solderability testing of electronic components for surface mount technology by the wetting balance method 环境试验.第2部分:试验. te试验:用加湿平衡法测试表面安装技术的电子元件的可焊性
Environmental testing - part 2 : tests - test te : solderability testing of electronic components for surface mount technology by the wetting balance method 基本环境试验规程.第2部分:试验.第69节:试验te :润湿平衡法对表面镶嵌技术用电子元件的软钎焊试验
Environmental testing - test methods - tests - test te - solderability testing of electronic components for surface mount technology by the wetting balance method 环境试验规程.第2部分:试验方法.第69节:试验te :润湿平衡法试验表面镶嵌技术用电子元件软钎焊
Environmental testing - part 2 : tests ; test te : solderability testing of electronic components for surface mount technology by the wetting balance method iec 60068 - 2 - 69 : 1995 ; german version en 60068 - 2 - 69 : 1996 环境试验.第2部分:试验.试验te :润湿称量法进行表面安
This text analyzed the application of automatic optical inspection from defect analysis and defect category and the process everyone ' s noodles of the defect inspection of surface mount technology printed - circuit board 本文从表面贴装印刷电路板的缺陷分析和缺陷种类及缺陷检查过程各方面分析了自动光学检测系统的应用。
During these years , the main fact of surface mount technology ( smt ) industry is the shorter produce period , the shorter time of product which put in market , the smaller produce batch , the more new technology 竞争日益激烈、产品投放市场的时间日益缩短、生产周期越来越短、生产批量越来越小、新技术不断引入,这些是表面贴装技术( smt )行业所存在的不争的事实。
On the basis of virtual evolving technology of surface mount technology ( smt ) for the solder joints , design for manufacturing ( dfm ) is employed , and dfm - oriented smt virtual assembly system targeted at assembly quality and solder joint reliability is developed 摘要在表面组装技术焊点虚拟成形技术的基础上,运用面向制造的设计思想,以表面组装技术组装质量与焊点可靠性为目标,研究面向表面组装技术生产组装工艺设计的产品虚拟组装系统。