中英
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层间连接的英文
发音:
- 英文翻译
- 造句
- interlayer bonding
- interlayer connection
- interlayer continuity
- 层 I storey; tier; stratum
- 间 space in between; opening
- 连接 connect; fit together; link; ...
- 板间连接器 mother daughter board connector
- 表面间连接 interfacial connection
- 段间连接 intersegment link
- 分子间连接 intermolecular ligation
- 级间连接器 interstage connector
- 空间连接 spatial join
- 时间连接 time connection
- 时间连接点 time tie
- 网间连接 internetwork connection
- 网间连接器 gateway
- 细胞间连接 cell-cell junction
- 相间连接线 interphase connection
- 中间连接 intermediate junction
- 中间连接器 intermediate connector
- 模块间连接器 amc atm inter-module connector atm; imc inter-module connector
- 网关；网间连接器 gateway
- 网间连接设备 ste signaling terminal equipment
- 网间连接装置 gateway device
- 直接网间连接 direct internet connection
- 中间连接螺母 interconnecting nut
- 中间连接配件 intermediate fitting
- 参与者网间连接器 participant gateway
- Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification
印制电路板.层间连接刚性印制电路板.分规范 - Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.分规范 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification iec 62326 - 4 : 1996 ; german version en 62326 - 4 : 1997
印制电路板.第4部分:层间连接刚性多层印制电路板.分 - Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification - capability detail specification - performance levels , a , b and c
印制电路板.层间连接刚性印制电路板.分规范.性能详细规格. a , b和c级性能水平 - Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification . section 1 : capability detail specification performance levels a , b and c
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.第1节:容量详细规范性能等级a b和c - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification ; section 1 : capability detail specification ; performance levels a , b and c iec 62326 - 4 - 1 : 1996 ; german version en 62326 - 4 - 1 : 1997
印制电路板.第4部分:层间连接刚性多层印制电路板.分 - In this case components should be mounted on a board having a continuous copper ground plane ( ideally on both sides of the board , though while convenient this is not essential ) , with ground connections made to the plane and short point to point wiring made above and below it
用于搭试的电路板最好有连续的地层（如果双面都有地层就更理想了，虽然调试起来会不太方便） ，这样接地的导线和层间连接线都会比较短。
- 层间连接的日语：そうかんせつぞく
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Last modified time:Fri, 15 Aug 2025 00:29:56 GMT
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