固化条件的英文

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英文翻译
造句

condition of cure

固化 welding; solidify; solidifyi ...
条件 condition; term; factor
范化条件, 标准化条件 normalization condition
标准化条件 normalization conditions
低氧化条件 less oxidizing condition
恶化条件 impaired condition
风化条件 weathering condition
高氧化条件 higher oxidizing condition
规范化条件 normalization condition
归一化条件 normalization condition; normalizing condition
极小化条件 minimization condition
简化条件 reduced condition
老化条件 ageing condition; aging condition
量化条件 quantum condition
量子化条件 quantization condition
裂化条件 cracking conditions
硫化条件 conditions of vulcanization; cure conditions; curing conditions
强化条件 intensified condition
熔化条件 melting condition; melting crucible
数字化条件 quantum condition
氧化条件 oxidizing conditions
正规化条件 normalization condition
简化条件语句 chapter 9：simplifying conditional expressions
降级氧化条件 degenerative oxidizing conditions
拘束磁化条件 forced magnetization conditions

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例句与用法

Low temperature flexible , easily pourable rtv silicone sealant / encapsulant , can be used with a wide variety of curing agents , thus varying pot life , cure time , mix ratios and cure conditions
低温弹性，易浇注的rtv密封硅胶，可与多种固化剂使用，可改变灌胶时间、固化时间、混合比率以及固化条件。
A comprehensive research was conducting on the relations among its solidified behavior , vitrification point , adhesive power , impact strength and peel strength . the best solidification conditions of conducting electrostatic coating was established .
研究了导电涂层固化行为与玻璃化温度、附着力、冲击强度和剥离强度之间的关系,确立了导电涂料的最佳固化条件。
Low viscosity , excellent electrical properties , used extensively as a high voltage potting compound as well as an encapsulating compound for delicate circuitry , can be used with various curing agents , thus varying pot life , cure time , mix ratios and cure conditions
低粘度，有着出色的电气性能，广泛地应用为高压灌封化合物和精密电路密封化合物，可与多种催化剂使用，可改变灌胶时间、固化时间、混合比率以及固化条件。
The characteristics of ito films prior to and post the pi and hot - press heating cure in the manufacturing processes of lcd have been researched to provide guidance for selecting lcd flat panel and enacting of pi and hot - press heating cure conditions in the processes design
研究了ito导电膜在lcd工艺流程中pi高温固化热处理前后和热压固化热处理前后的电性能特性，为工艺设计中lcd基材的选配及pi 、热压固化条件的设定提供指导。
The results show that : ( 1 ) the cure is accelerated by increasing the usage of cure catalyst and cure temperature , but cure effect is bad with too fast speed , so 3 . 5 % cure catalyst and 80 cure temperature were cheese
研究结果表明：（ 1 ）增加促进剂用量，提高固化温度对共混物的凝胶速度有明显的促进作用，但凝胶速度过快会导致低分子物挥发不完全，影响固化效果，通过对比我们选择的固化条件为：促进剂用量3 . 5 % ，固化温度为80 。
It was benefited that the cost of structural adhesive was descended by nanosize caco3 replaced some nanosize sio _ 2 , too . organic - montmorillonite and epoxy resin were intercalated and compounded by curing at 80 . the mechanical properties were improved obviously , steel - steel shear strength and impact strength were most advanced thereinto
有机蒙脱土和环氧树脂在80的固化条件下能够进行插层复合,插层复合改性后的力学性能有较大的提高,其中钢钢抗剪强度和冲击强度的提高最为显著。