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process gas中文什么意思

发音:   用"process gas"造句

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  1. The method according to claim 1 , wherein the third step comprises a period of supplying the second process gas to the process field while exciting the second process gas by an exciting mechanism
    如请求项1之方法,其中该第三步骤包含将该第二制程气体供应至该制程区域同时藉由一激发机制来激发该第二制程气体的一周期。
  2. Royco 889 is a synthetic - based lubricant formulated for use in gas compression applications that require wide operating temperature ranges and minimun interaction between the lubricant and the process gas
    Royco 889是一种合成型的润滑油,专门设计用于需要宽工作温度范围且能最大程度上减少润滑油与气体反应的气体压缩过程。
  3. A film formation method for a semiconductor process is arranged to form a thin film on a target substrate by cvd , while supplying a first process gas for film formation and . a second process gas for reacting with the first process gas to a process field accommodating the target substrate
    本发明揭示一种用于半导体制程之薄膜形成方法,其系配置成藉由cvd在目标基板上形成薄膜,同时将用于薄膜形成的第一制程气体及用于与该第一制程气体反应的第二制程气体供应至一容纳该目标基板的制程区域。
  4. The stronger combination of fiber and matrix after plasma treatment was discovered . the mechanism of reinforcement of interface combination with plasma treatment was developed as follows : by means of plasma treatment , the wettability of fiber ' s surface was increased , specific area of fiber was enhanced owing to the etching process , the meshing engagement between fiber and matrix was enhanced . with the same parameter ( power , vacuum degree , processing gas ) , the optimum time of plasma treatment is 1 2 minutes
    证明了纤维的等离子体处理对纤维与基体的界面结合的提高作用;分析了纤维的等离子体处理增强界面结合的作用机理:一为提高了纤维表面的浸润性;二为对纤维表面的刻蚀作用,增加了纤维的比表面积,同时增强了纤维与基体界面间的机械啮合作用;并得出了在相同处理参数(功率、真空度和工作气体)下等离子体处理的最佳时间为1 2分钟。

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