Study on the interfacial coordination of copper ion to the imidazole - terminated self assembled monolayers on gold electrodes 含咪唑烷基硫醇自组装膜界面铜离子配位研究
Determination of copper ion concentration by conductometric titration method using chelate complextriethylenetetramine as the titration agent 三乙烯四胺螯合电导滴定法测定常量铜离子浓度
2 ) measured the survival curves for the cells overexpressing mutant alleles of gpil7p and chosed the proper cu2 + concentration in the medium for inducing 2 )测定过表达了突变gpi17p细胞的存活曲线,并确定了培养介质中诱导物铜离子的适宜浓度。
Electroless copper depositing processess are controlled by the kinetics of formal dehyde oxidation reaction , which donate electron for the cathodic reduction of cupric ions 摘要化学镀铜反应受甲醛氧化过程动力学控制,甲醛氧化为铜离子还原提供电子。
Secondly , the adsorbents for pretreatment were selected . activated carbon ( tac4 . 0 ) and activated carbon ( hac1 . 5 ) supported with 0 . 8 % cu2 + showed good performance 然后筛选了合适的预处理吸附剂,发现tac4 . 0和用0 . 8铜离子改性的hac1 . 5的预处理性能较好。